#10. Interface-driven Phenomena in Condensed Matter Systems: Thermodynamics, Kinetics, and Chemistry
- Fadi Abdeljawad, Clemson University (email@example.com)
- Haidong Fan, Sichuan University, China
- Yasushi Shibuta, The University of Tokyo, Japan
- Tomoaki Suzudo, Japan Atomic Energy Agency, Japan
- Mitra Taheri, Johns Hopkins University, USA
- Damien Tourret, IMDEA Materials, Spain
- Michael Zaiser, FAU Universität Erlangen-Nürnberg, Germany
- Caizhi Zhou, Missouri University of Science and Technology, USA
DescriptionInterfaces greatly influence a wide range of processes that give rise to the observable properties (e.g., mechanical, transport) of polycrystalline materials. The role of materials interfaces becomes dominant in systems where the characteristic length scale is reduced into the nanometric scale. The goal of this symposium is to bring together researchers across a wide range of disciplines to communicate recent developments pertaining to interface-dominated phenomena. Theoretical, analytical, and computational modeling frameworks across all scales will be considered (e.g., atomistic, Monte Carlo, phase field, level set, discrete element, etc.).
The symposium will address fundamental science, methods development, and applications in the following areas:
• Thermodynamics and chemistry: segregation, phase transformation, energies, etc.
• Kinetics: recrystallization, grain growth, coarsening, faceting, solidification, etc.
• Interface structure: Structure-property and structure-chemistry relationships
• Interfaces beyond single phase, single component systems
• Methods development and novel techniques to bridge length and time scales
• Theories and models integrating multiple length scales, and studies that combine modeling and simulations with state-of-the-art experimental techniques (e.g. in situ characterization of interface dynamics, etc.)
• Interface stability (or metastability) and evolution
• Interfaces by design: Development of techniques to obtain and control production of desired interfaces (grain boundary engineering, deformation twinning, etc.)
• Interfaces under extreme environments (thermal, mechanical, radiation, etc.)