#22. Multiscale Modeling of Polymers and Soft Materials

Organizers

  • Shengqiang Cai, University of California, San Diego, USA
  • Hansohl Cho, Korea Advanced Institute of Science and Technology, Korea
  • Sung Hoon Kang, Johns Hopkins University, USA
  • Victor Lefevre, Northwestern University, USA (victor.lefevre@northwestern.edu)
  • Stephan Rudykh, University of Wisconsin, USA
  • Meredith Silberstein, Cornell University, USA
  • Qiming Wang, University of Southern California, USA

Description

Polymers and soft materials have received an ever-so growing interest in recent years driven by their versatile ability to enable new technologies in a broad variety of engineering and biological contexts. Their structure at the molecular and microscopic length scales directly controls their response (e.g., deformations, instabilities, toughness, self-healing) under externally applied stimuli of different physical natures (mechanical, electrical, magnetic, chemical) and yields to a wide range of novel material responses that can be tailored by device-specific material and molecular/microstructural design choices. Without appropriate understanding and modeling of their behavior at a specific length scale and across length scales, the technological usage of this promising class of materials will remain limited. This topic also encompasses soft biological tissues for bio-medical applications.

This symposium will bring together researchers from a broad variety of engineering, physics and chemistry disciplines with modeling, experimental, and simulation expertise to discuss recent advancements and new directions in the field.

Materials and topics interest include:
• Electroactive and magnetoactive elastomers
• Hydrogels and other soft wet materials
• Liquid crystal elastomers
• Shape-memory and light-sensitive polymers
• Mechanics and rheology of soft biological and bio-inspired materials
• Foams and Mechanical Metamaterials
• Multiphysics phenomena in soft materials
• Fracture, and adhesion in soft materials
• Material and structural instabilities
• Wave propagation and dynamics of soft materials
• Constitutive modeling and numerical simulation
• Multiscale approaches and homogenization
• Additive manufacturing and 3D printing processes

Confirmed Keynote Speakers

• Rui Huang (UT Austin, USA)
• Christian Linder (Stanford, USA)
• Xuanhe Zhao (MIT, USA)